类别 |
课程 |
细节 |
电子材料 Materials for Electronics |
丙烯酸树脂 Acryl Resin |
应用及功能表现 Performance and Application |
酚醛树脂 Phenolic Resin |
酚醛树脂, 羥基苯乙烯 Novolak, PHS |
聚酰亚胺 Polyimide |
聚酰亚胺基材 Polyimide Substrate |
含硅物料 Si-containing materials |
硅聚合物 Si-polymer, PDSS |
有机/无机 混合化合物 Organic/inorganic Hybrid |
湿化学处理 Sol-Gel MaterialSol-Gel |
感光性物料 Photofunctional Material |
感光聚合物、感光体、启动体 Photopolymer, Sensitizer, Initiator |
染料和颜料 Dyes and Pigments |
功能性染料颜料 Functional Dye and Pigment |
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光阻剂(集成电路,传感器、MEMS) Resist for Semiconductor, Sensor, MEMS |
线光足阻剂 g-line / i-line resist g/ i | 原材料 Raw materials (树脂 Resin, PAC, PAG, 添加剂 Additives) |
KrF Resist | 光阻设计与优化 Resist Design and Optimization |
Arf Resist, ArF-immersion (侵入式) Resist | 评估方法 Evaluation Method |
质控及量产 Quality Control and Mass Production |
光阻 EUV Resist | 解决难题及客户支援 Trouble Shooting and Customer Support |
电子束及X光光阻 EB and X-ray Resist | 应用及优化 Application and Optimization |
多层材料 Multi Layer Material | 底层防反光层 BARC (Bottom Anti Reflection Coating) |
SOH (Silicon Hard Mask) and SOC (Spin On Carbon) |
绝缘层 Insulating Layer | 绝缘材料 Insulating Materials |
Materials for SG Application | 低介质常数及低散失数 Low DK / Low Df Material |
3D整合 3D Integration | 永久及暂时粘接 Temporary / Permanent Bonding |
感光性聚酰亚胺 PSPI (Photo Sensitive Polyimide) | 设计及优化 Design and optimization |
负性影像 NTI (Negative Tone Imaging) | 负性影像材料 NTI Materials |
材料应用于CMOS传感器 Materials for CMOS Sensor Application | 微透镜、面层、平整层 Microlens, Overcoat, Planarizing Layer |
材料应用于MEMS Materials for MEMS Application | Semicconductor Package, OLED, Power Devices |
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平板显示用光阻 Resist for Display |
矩阵光阻 Array Resist | g-线 / i-线光 阻 g-line / i-line resist |
柔性显示材料 Materials for Flexible Display | 聚酰亚胺基材 Polyimide Substrate |
彩胶 Color Resist | 彩胶黑胶 R,G,B and Black Matrix Resist |
感光隔层胶 Photo Spacer | 设计及优化 Design and Optimization |
平整胶 Palanarization Resist | 平整及绝缘材料 Planarization and Insultation Materials |
玻璃蚀刻胶 Glass Etching Resist | 抗酸碱光阻 Acid and Akaline Resistant Resist |
有机无机混合化学物 Organic / Inorganic Hybrid | Sol/Gel 材料及应用 Sol/Gel Materials and Those Application |
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封装 Packaging Material | Build-up Film | 材料 ABF Related Materials Ajinomoto Build-up Film |
下世代光刻 NGL | 纳米压印 NIL (Nanoimprint lithography) | 纳米压印材料 NIL Materials |
下世代光刻材料 Next Generation materials | 定向自组装光刻 DSA (Directed Self Assembly) | 定向自组装光刻材料 DSA Materials |